Industrial and scientific project

DEVELOPMENT OF SOFTWARE PACKAGES SUITABLE FOR THE “IN-HOUSE” TCAD PLATFORM

Partner: Micron Technologies Period: March 2026 – March 2027

Project information

MOX responsible
Simona Perotto, Carlo de Falco
Team
Giacomo Speroni, Francesco Fischetti
Start date
March 2026
End date
March 2027

Abstract

Development of software packages to be included into the “In-house” TCAD platform of Micron Technologies for multi-physics device modeling. 1) Package for omputing the IdVg on MOS and Memory devices 2) Package to treat carrier transport in amorphous materials and ion migration (NAND charge migration, MOS degradation and mass transport) supporting adaptive meshing to enable robustness under high deformation fields 3) Investigating the feasibility of coupling the Partial Differential Equation engine with Deep Neural Networks (DNNs).